TEMATE TG-IL is an EMAT solution designed for measuring thickness of metallic materials with non-contact probes in harsh production environments. The equipment can be complemented with Laser Measurement of OD shape (TEMATETG-IL/LM) and/or conductivity measurement on aluminum tubes (TEMATE TG-IL/CM).
Features
Non-contact EMAT technique.
Appropriate for all metallic materials.
Probes for continuous measurement of materials up to 650⁰C.
No-wear sensors that do not touch the material inspected.
Great accuracy (+/-2.5µm) and lateral resolution (3mm).
Sensor arrays and touch probes for continuous and spot measurements.
100% tube coverage option using proprietary encircling ring technology.
Automatic calculation of eccentricity and ovality.
Complementary sensors for measurement of shape and conductivity (in aluminum).
Thickness measurement on internally tapered tubes.
Specifications
Technique: – Non-contact Electro Magnetic Acoustic Transducer (EMAT)
Materials Inspected: – Ferromagnetic and non-ferromagnetic metals, including carbon steel, stainless steel, aluminum, copper and brass. – Minimum thickness : 0.3mm (0.012”) contact Innerspec for thinner material – Surface temperature: from -30ºC (-22ºF) to 750ºC (1,382ºF)
Sensor Head Assembly: – Magnetic element and EMAT coil in a protective casing. – Sensors for high-temperature applications may incorporate air and/or water cooling depending on temperature and exposure time. – Designed for easy attachment to different mountings, and can incorporate air bearings or other systems to maintain adequate lift-off. – Automatic temperature compensation for high-temperature applications.
Instrumentation: – Strip, plate and tube thickness measuring instrument called PRIMO SC. – IP54 industrial enclosure can be located up to 2m from point of inspection. – Different enclosures can handle from 1 to 8 channels simultaneously. – 1 Channel Enclosure. Dimensions: 252mm L x 169mm W x 57mm T. Weight: 1.5Kg – Accessible by any device connected to the instrument’s IP address via WiFi or Ethernet.
